Recent experiments on bent Si monocrystals performed at Semiconductors and Sensors Laboratory of the University of Ferrara open up the possibility for development of highly efficient crystalline micro- undulators. In this contribution, we report on a promising line of research which considers the curvature induced by deposition of Si3N4 on a Si monocrystal circular plate. Our goal is to identify the residual stress induced by Si3N4 deposition. Firstly, we study the equilibrium problem of a composite thin plate made by two different incrementally linear elastic materials with stressed reference configura- tions. Then, we establish a relationship between the residual stress and the plate deformation on the basis of an analytical solution obtained in the framework of finite elasticity. This is used to obtain a first identification of residual stress from displacement measurements.

Identification of internal residual stress parameters in silicon/silicon nitride bilayers for implementation of a crystalline micro-undulator

BENVENUTI, Elena;RIZZONI, Raffaella;TRALLI, Antonio Michele;GUIDI, Vincenzo;MALAGU', Cesare;MARTINELLI, Giuliano;STEFANCICH, Marco;VINCENZI, Donato
2003

Abstract

Recent experiments on bent Si monocrystals performed at Semiconductors and Sensors Laboratory of the University of Ferrara open up the possibility for development of highly efficient crystalline micro- undulators. In this contribution, we report on a promising line of research which considers the curvature induced by deposition of Si3N4 on a Si monocrystal circular plate. Our goal is to identify the residual stress induced by Si3N4 deposition. Firstly, we study the equilibrium problem of a composite thin plate made by two different incrementally linear elastic materials with stressed reference configura- tions. Then, we establish a relationship between the residual stress and the plate deformation on the basis of an analytical solution obtained in the framework of finite elasticity. This is used to obtain a first identification of residual stress from displacement measurements.
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in SFERA sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11392/521946
 Attenzione

Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo

Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus ND
  • ???jsp.display-item.citation.isi??? ND
social impact