Optical wireless networks-on-chip (OWiNoC) are considered as a possible solution to overcome the communication bottleneck due to wired interconnects in modern chip multi-processor systems. The efficient implementation of optical wireless links requires considering many different aspects, including analysis and deep understanding of the effects on the propagation of the electromagnetic field induced by the discontinuities that can be found in a realistic scenario. This letter aims at showing the impact determined by some of these discontinuities on optical links designed in Silicon-on-Insulator technology, exploiting simple point-to-point interconnections as a first example. Measurements and simulations confirm that multi-path phenomena, triggered by the multi-layer structure housing the antennas and the propagation paths, can have a serious impact on the link budget, with fading effects that may compromise the performance of the link. However, in the presented experimental results, thanks to a careful choice of the chip layer structure, received powers higher than those which could have been measured for optical links fabricated in an infinite homogeneous medium are observed, thus resulting beneficial for the connection's power budget.

Multi-path propagation in on-chip optical wireless links

Bellanca G.
Secondo
Conceptualization
;
Kaplan A. E.
Membro del Collaboration Group
;
Tralli V.
Conceptualization
;
2020

Abstract

Optical wireless networks-on-chip (OWiNoC) are considered as a possible solution to overcome the communication bottleneck due to wired interconnects in modern chip multi-processor systems. The efficient implementation of optical wireless links requires considering many different aspects, including analysis and deep understanding of the effects on the propagation of the electromagnetic field induced by the discontinuities that can be found in a realistic scenario. This letter aims at showing the impact determined by some of these discontinuities on optical links designed in Silicon-on-Insulator technology, exploiting simple point-to-point interconnections as a first example. Measurements and simulations confirm that multi-path phenomena, triggered by the multi-layer structure housing the antennas and the propagation paths, can have a serious impact on the link budget, with fading effects that may compromise the performance of the link. However, in the presented experimental results, thanks to a careful choice of the chip layer structure, received powers higher than those which could have been measured for optical links fabricated in an infinite homogeneous medium are observed, thus resulting beneficial for the connection's power budget.
2020
Nanni, J.; Bellanca, G.; Calo, G.; Alam, B.; Kaplan, A. E.; Barbiroli, M.; Fuschini, F.; Dehkordi, J. S.; Tralli, V.; Bassi, P.; Petruzzelli, V.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11392/2437180
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