CINECA IRIS Institutional Research Information System
IRIS è la soluzione IT che facilita la raccolta e la gestione dei dati relativi alle attività e ai prodotti della ricerca. Fornisce a ricercatori, amministratori e valutatori gli strumenti per monitorare i risultati della ricerca, aumentarne la visibilità e allocare in modo efficace le risorse disponibili.
EnglishThe results of a numerical investigation of heat and fluid flow in a liquid cold plate for FM radio power amplifiers are presented. The objective is to verify, by using a commercial CFD code, the performance of a blister cold plate designed to dissipate the heat generated by a known set of electronic components, in order to limit their maximum temperature during operations. Since in a blister cold-plate mainly the cover is thermally active, the cold-plate is simplified and lightened by using plastics in the base plate. A 3-D conjugate CFD approach, where thermal and fluid flow analyses are combined, is followed. Several design options for the cold plate are examined and the validity of the full 3-D CFD approach in the dimensioning of the cooling systems of electronic equipment is demonstrated.
| Titolo: | Numerical Analysis of a Cold Plate for FM Radio Power Amplifiers |
| Autori: | |
| Data di pubblicazione: | 2014 |
| Rivista: | |
| Abstract: | The results of a numerical investigation of heat and fluid flow in a liquid cold plate for FM radio power amplifiers are presented. The objective is to verify, by using a commercial CFD code, the performance of a blister cold plate designed to dissipate the heat generated by a known set of electronic components, in order to limit their maximum temperature during operations. Since in a blister cold-plate mainly the cover is thermally active, the cold-plate is simplified and lightened by using plastics in the base plate. A 3-D conjugate CFD approach, where thermal and fluid flow analyses are combined, is followed. Several design options for the cold plate are examined and the validity of the full 3-D CFD approach in the dimensioning of the cooling systems of electronic equipment is demonstrated. |
| Handle: | http://hdl.handle.net/11392/2332819 |
| Appare nelle tipologie: | 03.1 Articolo su rivista |
File in questo prodotto:
http://hdl.handle.net/11392/2332819
Copyright © 2020